Tummala Rao R.:
System On Package

Miniaturization Of The Entire System

Mcgraw-Hill Education - Europe (United States), 2008
Hardback, 785 pages
Size: 241x193 mm
ISBN: 9780071459068
ISBN-10: 0071459065

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System On Package

"System-on-Package" (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. This book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this packaging technology can be used to solve pressing electronics design challenges.

Related links:

Rao R. Tummala
Electronics engineering
Electronics & communications engineering
Technology, engineering, agriculture, veterinary science
Mcgraw-Hill Education - Europe

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Rao R. Tummala
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